Asian Journal of Information Technology

Year: 2004
Volume: 3
Issue: 8
Page No. 623 - 627

Electronic Data Interchange (EDI): A Strategic Weapon for Bills of Lading in Shipping Industry

Authors : Mohammed Shamim Uddin Khan , Mohammed Shahedul Quader and Tanvir Mohammad Hayder Arif

Abstract: Technological innovation plays always an important role on the economy and business. From the very beginning point of the industrial revolution, businesses are more susceptible to technological advancement. As the process of technological advancement, information technologies were introduced at the end of the last century. Within a very shorter period, it became one of the major strategic weapons for business. Accordingly, computer systems and technologies development affect shipping business. Various organizations including exporters, importers, banks, government authorities and freight forwarders etc. require information about the goods. This information must be accurate. The information can be interchanged or exchanged in the form of data, which is transmitted and received electronically. EDI is the electronic system by which a computer can formally exchange information with one or more other computers without the need of paper. However, EDI can also be seen as a means of transmitting commercial documents electronically. Its main purposes, apart from speeding the flow of information, which is essential to trade, are to replace the paper bill of lading and to avoid or to minimize fraud. The paper focuses the role of EDI for bill of lading for the purpose of doing effective and efficient shipping and trade in a complex trade environment. The paper also identified some problems associated with electronic bills of lading and suggests some measures to overcome the identified problems.

How to cite this article:

Mohammed Shamim Uddin Khan , Mohammed Shahedul Quader and Tanvir Mohammad Hayder Arif , 2004. Electronic Data Interchange (EDI): A Strategic Weapon for Bills of Lading in Shipping Industry . Asian Journal of Information Technology, 3: 623-627.

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