Journal of Engineering and Applied Sciences

Year: 2021
Volume: 16
Issue: 4
Page No. 147 - 151

Automatic Heat Dispel System for DINGSON Biscuit Oven using Thermocouple Temperature Sensor

Authors : Mustefa Jibril, Hemen Tesfaye, Tadele Beyene and Tsinukal Moges

Abstract: In this study, an automatic heat dispel system for DINGSON Biscuit Oven have been designed and simulated using Proteus program successfully. This system uses thermocouple temperature sensor to sense the oven temperature and automatically open and close the dispel system. The temperature in which the dispel open and close can be adjusted any time the operator needs to adjust it.

How to cite this article:

Mustefa Jibril, Hemen Tesfaye, Tadele Beyene and Tsinukal Moges, 2021. Automatic Heat Dispel System for DINGSON Biscuit Oven using Thermocouple Temperature Sensor. Journal of Engineering and Applied Sciences, 16: 147-151.

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