Journal of Engineering and Applied Sciences

Year: 2019
Volume: 14
Issue: 11
Page No. 3707 - 3710

Diffusion Modelling of Digital Payments

Authors : R. Pradheep Balaji and T. Vijayakumar

Abstract: This study studies the adoption of digital payments by lead adopters-college students in Kanchipuram District in India. The intent is to identify key drivers for adoption of digital payment applications by students between the age group of 17-22 years old. The study tries to establish the logical relation between latent constructs in an individual’s behavior/preferences and the outcome of different logical combinations driving to adoption of digital payments. In this study, digital payment refers to e-Wallet applications like Paytm, BHIM, PayZapp, etc. The first study was done amongst college student who joined college and in the first week of academic cycle. The second study was done amongst same student who had finished first year. In the intermediate period it is interesting to observe that adoption of digital payments has increased from 12-76%. Digital payment adoptions analyzed through social network propagation. More people are using cards at point of sale devices and just not ATMs. This apart many inactive debit card users have started using the cards. This study is attempting to understand the behavioral shift amongst users in India by taking the example of a set of lead adopters of technology vis-a-vis digital payments. We have taken college students, since, they are considered lead adopters in mobile usage and expected to have some adoption levels of digital payments also. Structural tapping, social reinforcement and homophily are 03 key influence factors amongst student population for adoption of digital payments. Two key findings of the study includes: ease of use and security are considered the most important factor for adoption of digital payments. Incentives to adopt digital payments.

How to cite this article:

R. Pradheep Balaji and T. Vijayakumar, 2019. Diffusion Modelling of Digital Payments. Journal of Engineering and Applied Sciences, 14: 3707-3710.

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