Authors : Sameer Hashim Ameen, Deyaa Mohammed Noori Mahmood and Younus Fahad Breesam
Abstract: Many computers suffer from excessive temperature rise due to continuous use or the use of software that needs high processing speed or use of computers in high temperature-warming environments such as countries in the Middle East. Computer efficiency is directly related to the efficiency of the CPU in data processing and any lag due to high temperatures may result in software damage. Heat sink is a device mounted on the processor that works to dissipate generated heat in the processor to surrounding ambient by conduction first and later by convection. Enhancing heat dissipation is achieved by cutting a piece of aluminum of (41×38×3 mm) from the base of a typical heat sink and then compensate it by same size of new material (copper). The adding of a copper piece will increase the heat transfer by conduction due to having higher thermal conductivity than aluminum. On other hands, it makes contact to the processor lower surface extra smooth due to a high reduction in the coefficient of friction is achieved which reached to 36.1% compared to the old heat sink surface that resaecrh to eliminate convection accompanying to non-complete contact between the processor surface and rough surface of the ordinary aluminum heat sink. The copper-aluminum heat sink has a higher factor of safety (for yield stress) reached 4.01 compared to only 2.35 in heat sink without copper. Rejection in heat flux with copper is increasing to 23.3% in addition to higher heat dissipation to weight ratio of 15.5% when all these items compared to sink without copper. The all numerical investigations are determined in the present work is done using ANSYS Program V.11.
Sameer Hashim Ameen, Deyaa Mohammed Noori Mahmood and Younus Fahad Breesam, 2019. Enhancement of Heat Dissipation from Computer Processor using Layer Copper-Aluminum Composite Materials. Journal of Engineering and Applied Sciences, 14: 9048-9055.