References

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Triantafyllidis, D., J.R. Bernstein, L. Li and F.H. Stott, 2003. Dual laser beam modification of high alumina ceramics. J. Laser Appl., 15: 49-54.
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Ueda, T., K. Yamada, K. Oiso and A. Hosokawa, 2002. Thermal stress cleaving of brittle materials by laser beam. CIRP. Ann. Manuf. Technol., 51: 149-152.

Ueda, T., T. Mino, T. Furumoto, A. Hosokawa and S. Nagatomo, 2011. Laser cleaving of sapphire wafer with pulsed wafer. J. Jpn. Soc. Grinding Eng., 55: 424-426.