References

Baviskar, P.V., K.A. Saner, N.P. Salunke and V.B. Jadhav, 2016. To analyze the effect of varying fin shapes for microprocessor cooling. Intl. J. Innovative Res. Sci. Eng. Technol., 5: 5613-5621.
CrossRef  |  Direct Link  |  

Carr, J.D., 2014. An examination of CPU cooling technologies: Thermal management options for engineers. Master Thesis, DSI Ventures Inc, Tyler, Texas.

Chiang, J.S., S.H. Chuang, Y.K. Wu and H.J. Lee, 2005. Numerical simulation of heat transfer in a desktop computer with heat-generating components. Intl. Commun. Heat Mass Transfer, 32: 184-191.
CrossRef  |  Direct Link  |  

Chung, D.D.L., 2001. Materials for thermal conduction. Appl. Therm. Eng., 21: 1593-1605.
CrossRef  |  Direct Link  |  

Chung, D.D.L., 2001. Materials for thermal conduction. Appl. Therm. Eng., 21: 1593-1605.
CrossRef  |  Direct Link  |  

Go, J.S., 2005. Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick structure for advanced microprocessor cooling. Sens. Actuators A. Phys., 121: 549-556.
CrossRef  |  Direct Link  |  

Kumar, V.M., S. Farooq and P.H.C. Prasad, 2016. CFD analysis on a heat sink by using grapheme. Intl. J. Sci. Technol. Manage., 5: 116-123.

Liu, Y.P., Z.P. Xu and Q. Zhu, 2012. The simulation and optimization of the CPU heat sink for a new type of graphite. J. Environ. Eng. Technol., 1: 8-11.
Direct Link  |  

Magadum, P.P. and G.M. Shamrao, 2015. Analysis and optimization of processor cooling fins. Intl. J. Eng. Innovative Technol., 5: 90-94.
Direct Link  |  

Mochizuki, M., Y. Saito, T. Nguyen, V. Wuttijumnong and X. Wu et al., 2005. Revolution in fan heat sink cooling technology to extend and maximize air cooling for high performance processors in laptop/desktop/server application. Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS and Electronic Systems, July 17-22, 2005, American Society of Mechanical Engineers, New York, USA., pp: 431-437.

Mohan, R. and P. Govindarajan, 2011. Experimental and CFD analysis of heat sinks with base plate for CPU cooling. J. Mech. Sci. Technol., 25: 2003-2012.
CrossRef  |  Direct Link  |  

Navas, R.K.B., B.V.C. Vignan, M. Durganadh and C.R. Krishna, 2017. Analysis and optimization of central processing unit process parameters. Mater. Sci. Eng., 197: 1-10.
CrossRef  |  Direct Link  |  

Saini, M. and R.L. Webb, 2003. Heat rejection limits of air cooled plane fin heat sinks for computer cooling. IEEE. Trans. Compon. Packag. Technol., 26: 71-79.
CrossRef  |  Direct Link  |  

Tewari, I., N. Joshi, S. Sharma, P.S. Mehra and A. Melkani et al., 2017. Heat optimization of processor cooling by varying casing material. Intl. J. Emerging Technol., 8: 702-706.
Direct Link  |